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The Resource Handbook of silicon wafer cleaning technology, edited by Karen A. Reinhardt, Werner Kern

Handbook of silicon wafer cleaning technology, edited by Karen A. Reinhardt, Werner Kern

Contributor
Summary
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included." Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits." As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries." Covers processes and equipment, as well as new materials and changes required for the surface conditioning process." Editors are two of the top names in the field and are both extensively published." Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Language
eng
Work
Publication
Edition
2nd ed.
Extent
1 online resource (xxvi, 718 pages)
Contents
  • Part 1: Introduction and Overview
  • Overview and Evolution of Silicon Wafer Cleaning Technology
  • Overview of Wafer Contamination and Defectivity
  • Part 2: Wet-Chemical Processes
  • Particle Deposition and Adhesion
  • Aqueous Cleaning and Surface Conditioning Processes
  • Part 3: Dry Cleaning Processes
  • Gas-phase Wafer Cleaning Technology
  • Plasma Stripping and Cleaning
  • Cryogenic Aerosols and Supercritical Fluid Cleaning
  • Part 4: Analytical and Control Aspects
  • Detection and Measurement of Particulate Contaminants
  • Surface Chemical Composition and Morphology
  • Ultratrace Impurity and Surface Morphology Analysis
  • Analysis and Control of Electrically Active Contaminants
  • Part 5: Directions for the Near Future
Isbn
9780815517719
Instance
Label
Handbook of silicon wafer cleaning technology
Title
Handbook of silicon wafer cleaning technology
Statement of responsibility
edited by Karen A. Reinhardt, Werner Kern
Contributor
Subject
Language
eng
Summary
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included." Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits." As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries." Covers processes and equipment, as well as new materials and changes required for the surface conditioning process." Editors are two of the top names in the field and are both extensively published." Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Member of
Cataloging source
BUF
Dewey number
621.3815/2
Illustrations
illustrations
Index
index present
LC call number
TK7871.85
LC item number
.H338 2008eb
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
  • handbooks
http://library.link/vocab/relatedWorkOrContributorDate
1925-
http://library.link/vocab/relatedWorkOrContributorName
  • Reinhardt, Karen A
  • Kern, Werner
Series statement
Materials science & process technology series
http://library.link/vocab/subjectName
  • Silicon-on-insulator technology
  • TECHNOLOGY & ENGINEERING
  • TECHNOLOGY & ENGINEERING
  • Silicon-on-insulator technology
Label
Handbook of silicon wafer cleaning technology, edited by Karen A. Reinhardt, Werner Kern
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Part 1: Introduction and Overview -- Overview and Evolution of Silicon Wafer Cleaning Technology -- Overview of Wafer Contamination and Defectivity -- Part 2: Wet-Chemical Processes -- Particle Deposition and Adhesion -- Aqueous Cleaning and Surface Conditioning Processes -- Part 3: Dry Cleaning Processes -- Gas-phase Wafer Cleaning Technology -- Plasma Stripping and Cleaning -- Cryogenic Aerosols and Supercritical Fluid Cleaning -- Part 4: Analytical and Control Aspects -- Detection and Measurement of Particulate Contaminants -- Surface Chemical Composition and Morphology -- Ultratrace Impurity and Surface Morphology Analysis -- Analysis and Control of Electrically Active Contaminants -- Part 5: Directions for the Near Future
Control code
297184847
Dimensions
unknown
Edition
2nd ed.
Extent
1 online resource (xxvi, 718 pages)
Form of item
online
Isbn
9780815517719
Lccn
2007037151
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations.
Specific material designation
remote
System control number
(OCoLC)297184847
Label
Handbook of silicon wafer cleaning technology, edited by Karen A. Reinhardt, Werner Kern
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Part 1: Introduction and Overview -- Overview and Evolution of Silicon Wafer Cleaning Technology -- Overview of Wafer Contamination and Defectivity -- Part 2: Wet-Chemical Processes -- Particle Deposition and Adhesion -- Aqueous Cleaning and Surface Conditioning Processes -- Part 3: Dry Cleaning Processes -- Gas-phase Wafer Cleaning Technology -- Plasma Stripping and Cleaning -- Cryogenic Aerosols and Supercritical Fluid Cleaning -- Part 4: Analytical and Control Aspects -- Detection and Measurement of Particulate Contaminants -- Surface Chemical Composition and Morphology -- Ultratrace Impurity and Surface Morphology Analysis -- Analysis and Control of Electrically Active Contaminants -- Part 5: Directions for the Near Future
Control code
297184847
Dimensions
unknown
Edition
2nd ed.
Extent
1 online resource (xxvi, 718 pages)
Form of item
online
Isbn
9780815517719
Lccn
2007037151
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations.
Specific material designation
remote
System control number
(OCoLC)297184847

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