Coverart for item
The Resource Lead-free solders, JAI guest editor, Narayan Prabu

Lead-free solders, JAI guest editor, Narayan Prabu

Label
Lead-free solders
Title
Lead-free solders
Statement of responsibility
JAI guest editor, Narayan Prabu
Contributor
Subject
Language
eng
Summary
"Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website
Member of
Cataloging source
DLC
Dewey number
621.9/77
Illustrations
illustrations
Index
no index present
LC call number
TK7836
LC item number
.L424 2011
Literary form
non fiction
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Prabhu, Narayan
  • ASTM Committee D-2 on Petroleum Products and Lubricants
Series statement
Journal of ASTM International selected technical papers
Series volume
STP1530
http://library.link/vocab/subjectName
  • Lead-free electronics manufacturing processes
  • Solder and soldering
Label
Lead-free solders, JAI guest editor, Narayan Prabu
Instantiates
Publication
Note
"Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--P. [iii]
Bibliography note
Includes bibliographical references
Carrier category
volume
Carrier category code
nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
Control code
698027265
Dimensions
23 cm
Extent
viii, 203 pages
Isbn
9780803175167
Isbn Type
(alk. paper)
Lccn
2010053870
Media category
unmediated
Media MARC source
rdamedia
Media type code
n
Other physical details
illustrations
System control number
(OCoLC)698027265
Label
Lead-free solders, JAI guest editor, Narayan Prabu
Publication
Note
"Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--P. [iii]
Bibliography note
Includes bibliographical references
Carrier category
volume
Carrier category code
nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
Control code
698027265
Dimensions
23 cm
Extent
viii, 203 pages
Isbn
9780803175167
Isbn Type
(alk. paper)
Lccn
2010053870
Media category
unmediated
Media MARC source
rdamedia
Media type code
n
Other physical details
illustrations
System control number
(OCoLC)698027265

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