Coverart for item
The Resource Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001, editors, Shefford P. Baker [and others]

Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001, editors, Shefford P. Baker [and others]

Label
Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001
Title
Stress-induced phenomena in metallization
Title remainder
Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001
Statement of responsibility
editors, Shefford P. Baker [and others]
Creator
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
CUS
Illustrations
illustrations
Index
index present
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
2001
http://bibfra.me/vocab/lite/meetingName
International Workshop on Stress-Induced Phenomena in Metallization
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorName
Baker, Shefford P
Series statement
AIP conference proceedings,
Series volume
v. 612
http://library.link/vocab/subjectName
  • Integrated circuits
  • Thin film devices
  • Electrodiffusion
  • Semiconductors
  • Metallic films
  • Aluminum films
  • Metallizing
Label
Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001, editors, Shefford P. Baker [and others]
Instantiates
Publication
Bibliography note
Includes bibliographical references and indexes
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Electromigration stresses and mechanisms -- Cyclic loading effects -- Stress voiding -- Deformation and stresses
Control code
49723827
Dimensions
25 cm
Extent
ix, 250 pages
Isbn
9780735400580
Lccn
2002102851
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
Label
Stress-induced phenomena in metallization : Sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001, editors, Shefford P. Baker [and others]
Publication
Bibliography note
Includes bibliographical references and indexes
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Electromigration stresses and mechanisms -- Cyclic loading effects -- Stress voiding -- Deformation and stresses
Control code
49723827
Dimensions
25 cm
Extent
ix, 250 pages
Isbn
9780735400580
Lccn
2002102851
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations

Library Locations

    • Engineering Library & Technology CommonsBorrow it
      W2001 Lafferre Hall, Columbia, MO, 65211, US
      38.946102 -92.330125
    • University of Missouri Libraries DepositoryBorrow it
      2908 Lemone Blvd, Columbia, MO, 65211, US
      38.919360 -92.291620
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