The Resource Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta, (electronic resource)

Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta, (electronic resource)

Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993
Title
Stress-induced phenomena in metallization
Title remainder
second international workshop, Austin, TX, March 1993
Statement of responsibility
editors, Paul S. Ho, Che-Yu Li, Paul Totta
Creator
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
OCLCE
Dewey number
621.3815/2
Illustrations
illustrations
Index
index present
LC call number
TK7871.85
LC item number
.S7652 1994
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
1993
http://bibfra.me/vocab/lite/meetingName
International Workshop on Stress-Induced Phenomena in Metallization
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Ho, P. S
  • Li, Che-Yu
  • Totta, Paul
Series statement
AIP conference proceedings
Series volume
no. 305
http://library.link/vocab/subjectName
  • Semiconductors
  • Integrated circuits
  • Interconnects (Integrated circuit technology)
  • Metallic films
  • Thin film devices
  • Aluminum films
  • Metallizing
  • Electrodiffusion
Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta, (electronic resource)
Instantiates
Publication
Note
  • "International Workshop on Stress-Induced Phenomena in Metallization ... Second ... held at the University of Texas at Austin on March 29-31, 1993"--P. vii
  • "DOE CONF-9303142"--T.p. verso
Antecedent source
file reproduced from original
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T.N. Marieb, E. Abratowski, J.C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M.A. Korhonen, P. Borgesen, D.D. Brown, C.-Y. Li, T.D. Sullivan and P.A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P.R. Besser and J.C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P.S. Ho, I.-S. Yeo, S.G.H. Anderson and C.K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T.D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G.M. Zorn
Control code
655116057
Dimensions
unknown
Extent
1 online resource (vii, 302 pages)
File format
one file format
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations.
Specific material designation
remote
System control number
(OCoLC)655116057
Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta, (electronic resource)
Publication
Note
  • "International Workshop on Stress-Induced Phenomena in Metallization ... Second ... held at the University of Texas at Austin on March 29-31, 1993"--P. vii
  • "DOE CONF-9303142"--T.p. verso
Antecedent source
file reproduced from original
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T.N. Marieb, E. Abratowski, J.C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M.A. Korhonen, P. Borgesen, D.D. Brown, C.-Y. Li, T.D. Sullivan and P.A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P.R. Besser and J.C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P.S. Ho, I.-S. Yeo, S.G.H. Anderson and C.K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T.D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G.M. Zorn
Control code
655116057
Dimensions
unknown
Extent
1 online resource (vii, 302 pages)
File format
one file format
Form of item
online
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations.
Specific material designation
remote
System control number
(OCoLC)655116057

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