Coverart for item
The Resource Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta

Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta

Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993
Title
Stress-induced phenomena in metallization
Title remainder
second international workshop, Austin, TX, March 1993
Statement of responsibility
editors, Paul S. Ho, Che-Yu Li, Paul Totta
Creator
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
GZM
Illustrations
illustrations
Index
index present
LC call number
TK7871.85
LC item number
.S765 1994
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
University of Texas at Austin
http://bibfra.me/vocab/lite/meetingName
International Workshop on Stress-Induced Phenomena in Metallization
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorDate
1993
http://library.link/vocab/relatedWorkOrContributorName
  • Ho, P. S
  • Li, Che-Yu
  • Totta, Paul
  • International Workshop on Stress-Induced Phenomena in Metallization
Series statement
AIP conference proceedings
Series volume
305
http://library.link/vocab/subjectName
  • Semiconductors
  • Integrated circuits
  • Interconnects (Integrated circuit technology)
  • Metallic films
  • Thin film devices
  • Aluminum films
  • Metallizing
  • Electrodiffusion
  • Metallic films
  • Aluminum films
Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta
Instantiates
Publication
Note
"DOE CONF-9303142.--T.p. verso
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T.N. Marieb, E. Abratowski, J.C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M.A. Korhonen, P. Borgesen, D.D. Brown, C.-Y. Li, T.D. Sullivan and P.A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P.R. Besser and J.C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P.S. Ho, I.-S. Yeo, S.G.H. Anderson and C.K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T.D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G.M. Zorn
Control code
30564183
Dimensions
25 cm
Extent
vii, 302 pages
Isbn
9781563962516
Lccn
94070650
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
(WaOLN)1590656
Label
Stress-induced phenomena in metallization : second international workshop, Austin, TX, March 1993, editors, Paul S. Ho, Che-Yu Li, Paul Totta
Publication
Note
"DOE CONF-9303142.--T.p. verso
Bibliography note
Includes bibliographical references and index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Direct Observation of the Growth and Movement of Electromigration Voids Under Passivation / T.N. Marieb, E. Abratowski, J.C. Bravman, M. Madden and P. Flinn -- Statistics of Stress Migration and Electromigration Failures of Passivated Interconnect Lines / M.A. Korhonen, P. Borgesen, D.D. Brown, C.-Y. Li, T.D. Sullivan and P.A. Totta -- Effects of Oxygen Addition During Al Deposition on Stress-Migration Induced Failure in Al Lines / H. Okabayashi and K. Aizawa -- X-Ray Determination of Strains, Stress, and Relaxation in Interconnect Metallizations / P.R. Besser and J.C. Bravman -- Thermal Stress and Plastic Deformation of Al Fine Line Structures: Effects of Oxide Confinement and Line Geometry / P.S. Ho, I.-S. Yeo, S.G.H. Anderson and C.K. Hu -- Predictive Modeling for Stress-Induced Void Formation in Al Lines / T.D. Sullivan -- Degradation of Passivated Aluminum Metallization by Mechanical and Electrical Stress / M. Schneegans and G.M. Zorn
Control code
30564183
Dimensions
25 cm
Extent
vii, 302 pages
Isbn
9781563962516
Lccn
94070650
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
(WaOLN)1590656

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