The Resource Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others]
Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others]
Resource Information
The item Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others] represents a specific, individual, material embodiment of a distinct intellectual or artistic creation found in University of Missouri Libraries.This item is available to borrow from 1 library branch.
Resource Information
The item Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others] represents a specific, individual, material embodiment of a distinct intellectual or artistic creation found in University of Missouri Libraries.
This item is available to borrow from 1 library branch.
- Language
- eng
- Extent
- xi, 372 pages
- Note
-
- Sponsoring organizations: AXO Dresden; Rruker AXS; Carl Zeiss SMT; FEI; Infineon Technologies; Rigaku, Soliton--T.p
- Subseries from web page
- Isbn
- 9780735403109
- Label
- Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005
- Title
- Stress-induced phenomena in metallization
- Title remainder
- Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005
- Statement of responsibility
- editors, Ehrenfried Zschech[and others]
- Title variation
-
- Stress induced phenomena in metallization
- 8th International Workshop on Stress-Induced Phenomena in Metallization
- Language
- eng
- Additional physical form
- Also available online.
- Cataloging source
- NHM
- Illustrations
- illustrations
- Index
- index present
- Literary form
- non fiction
- http://bibfra.me/vocab/lite/meetingDate
- 2005
- http://bibfra.me/vocab/lite/meetingName
- International Workshop on Stress-Induced Phenomena in Metallization
- Nature of contents
- bibliography
- http://library.link/vocab/relatedWorkOrContributorName
- Zschech, Ehrenfried
- Series statement
- AIP conference proceedings,
- Series volume
- v. 817
- http://library.link/vocab/subjectName
-
- Interconnects (Integrated circuit technology)
- Metal-metal bonds
- Strength of materials
- Nanostructured materials
- Semiconductors
- Copper
- Label
- Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others]
- Note
-
- Sponsoring organizations: AXO Dresden; Rruker AXS; Carl Zeiss SMT; FEI; Infineon Technologies; Rigaku, Soliton--T.p
- Subseries from web page
- Bibliography note
- Includes bibliographical references and indexes
- Carrier category
- volume
- Carrier category code
-
- nc
- Carrier MARC source
- rdacarrier
- Content category
- text
- Content type code
-
- txt
- Content type MARC source
- rdacontent
- Control code
- 64551195
- Dimensions
- 24 cm
- Extent
- xi, 372 pages
- Isbn
- 9780735403109
- Media category
- unmediated
- Media MARC source
- rdamedia
- Media type code
-
- n
- Other physical details
- illustrations (some color)
- Label
- Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others]
- Note
-
- Sponsoring organizations: AXO Dresden; Rruker AXS; Carl Zeiss SMT; FEI; Infineon Technologies; Rigaku, Soliton--T.p
- Subseries from web page
- Bibliography note
- Includes bibliographical references and indexes
- Carrier category
- volume
- Carrier category code
-
- nc
- Carrier MARC source
- rdacarrier
- Content category
- text
- Content type code
-
- txt
- Content type MARC source
- rdacontent
- Control code
- 64551195
- Dimensions
- 24 cm
- Extent
- xi, 372 pages
- Isbn
- 9780735403109
- Media category
- unmediated
- Media MARC source
- rdamedia
- Media type code
-
- n
- Other physical details
- illustrations (some color)
Subject
- Copper -- Electric properties -- Congresses
- Interconnects (Integrated circuit technology) -- Defects -- Congresses
- Metal-metal bonds -- Congresses
- Nanostructured materials -- Congresses
- Semiconductors -- Congresses
- Strength of materials -- Congresses
- Conference papers and proceedings
Genre
Member of
- AIP conference proceedings, Subseries on materials physics and applications
- AIP conference proceedings, no. 817
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<div class="citation" vocab="http://schema.org/"><i class="fa fa-external-link-square fa-fw"></i> Data from <span resource="http://link.library.missouri.edu/portal/Stress-induced-phenomena-in-metallization-/x7en_h606gs/" typeof="Book http://bibfra.me/vocab/lite/Item"><span property="name http://bibfra.me/vocab/lite/label"><a href="http://link.library.missouri.edu/portal/Stress-induced-phenomena-in-metallization-/x7en_h606gs/">Stress-induced phenomena in metallization : Eighth International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005, editors, Ehrenfried Zschech[and others]</a></span> - <span property="potentialAction" typeOf="OrganizeAction"><span property="agent" typeof="LibrarySystem http://library.link/vocab/LibrarySystem" resource="http://link.library.missouri.edu/"><span property="name http://bibfra.me/vocab/lite/label"><a property="url" href="http://link.library.missouri.edu/">University of Missouri Libraries</a></span></span></span></span></div>
